Printed Circuit Board (PCB) | Flexible Circuits | Rigid Circuits | MC PCB | PCB Assembly | Components Procurement
※ Digital camera ※ Computing
※ GPS ※ Mobile
※ Notebook ※ Wearables
※ Smart Phone ※ Consumer Electronics
※ IPAD ※ Industrial-Commercial-Instrumentation
※ Medical ※ Energy
※ Automotive ELectronic ※ Medical
※ Smart Home ※ Automotive
※ Telecommunications ※ Aerospace-Defense
| Project | Ability |
| Roll to roll (one side) | YES |
| Roll to roll (double) | NO |
| Volume to roll material width mm | 250 |
| Minimum production size mm | 250X250 |
| Maximum production size mm | 500X500 |
| SMT Assembly patch (Yes/No) | YES |
| Air Gap capability (Yes/No) | YES |
| Production of hard and soft binding plate(Yes/No) | 10 |
| Max layers(Hard) | 10 |
| Tallest layer(Soft plate) | 6 |
| Material Science | |
| PI | YES |
| PET | YES |
| Electrolytic copper | YES |
| Rolled Anneal Copper Foil | YES |
| PI | |
| Covering film alignment tolerance mm | ±0.1 |
| Minimum covering film mm | 0.175 |
| Reinforcement | |
| PI | YES |
| FR-4 | YES |
| SUS | YES |
| EMI SHIELDING | |
| Silver Ink | YES |
| Silver Film | YES |
| Material | Vendor | Ability |
| FCCL | Panasonic |
PI: 0.5mil -9mil 2L,RA、ED Cu |
| Dupont | ||
| Coverlay | Dupont |
PI: 0.5mil -2mil adhesive:0.5-2mil |
| Taiflex | ||
| CCL | ITEQ |
Mid. and High Tg FR4 Lead-free Halogen-free PI |
| SHENGYI | ||
| Arlon | ||
| EMC | ||
| Prepreg | ITEQ |
Mid. and High Tg FR4 Lead-free Halogen-free PI |
| VENTEC | ||
| EMC | ||
| Arlon | ||
|
Speacial Material |
Dupont Tk |
High frequency High speed |
| Panasonic LCP | ||
| Tatsuta | Shielding film | |
| Dupont Bondply | Bondfilm | |
| Stiffener | Taiflex | PI +adhesive |
| Hardcc | Ceramic + adhesive | |
| Others | FR4 + adhesive |
